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Complete 3D Circuit Boards in One Machine
Ag ink sintering
The silver ink is sintered by applying heat with an IR heater.
By repeating resin printing and circuit printing, it is possible to create multilayer circuit boards.
Ag paste dispensing
Instead of solder, we use a silver paste that hardens at 80°C. The silver paste is applied using a dispenser
Epoxy glue dispensing
To achieve high adhesion between the components and the circuit board,
FPM-Trinity prints epoxy glue at the center of each component.
Component placing
Components are placed using the integrated Fuji SMT machine.
Heat pressing
To improve conductivity and adhesion between the components and the circuit board, we perform heat pressing. Both the silver paste and the epoxy adhesive solidify at 80°C.
Epoxy glue around components
To enhance reliability, we print the same epoxy glue around the components.
Heat
The epoxy glue is cured by heating, completing the circuit board
Resin substrate printing
We use inkjet technology for printing. The material used is acrylic-based resin. By repeating the printing process, we can build layers up to a thickness of 0.5 mm.
The resin hardens when exposed to UV light. FPM-Trinity has the ability to control the thickness of the resin, which ensures high precision in the thickness of the objects. This precision improves the reliability of the completed devices.
Exposing to UV
Circuit printing
We use inkjet technology for printing. The ink contains a dispersion of silver nanoparticles.
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